13:00-16:30

CS Asia Conference-Opening Keynote

亚洲化合物半导体大会-开幕主题演讲

Day 1- Mar. 24th, 2026 Shanghai Ballroom 3 / 上海厅 3

13:15-13:30

Welcome Remark / 欢迎致辞
Lily Feng, President, SEMI China
冯莉，SEMI 中国总裁

Moderator / 主持人：

David XIAO, Board Chair of APT Electronics Co., Ltd./AscenPower

肖国伟，董事长，广东晶科电子股份有限公司/广东芯粤能半导体有限公司

13:30-14:00

GaN: Driving Efficiency & Empowering Future
氮化镓：驱动高效，赋能未来
Dr. Jeffrey Wang 王庆宇
CEO of Advanced Micro Semiconductors Co., Ltd.

总经理，上海新微半导体有限公司

14:00-14:30

GaN: Enabling the Next Generation of High-Density AI Powertrain
氮化镓：赋能新一代高密度AI电源平台

Dr. Johannes Schoiswohl
Senior Vice President and General Manager, GaN Business Line
Infineon Technologies

14:30-15:00

Advancing Power and Compound Semiconductor Performance Through Ion Implantation Innovation

离子注入技术创新驱动功率与化合物半导体性能提升

Dr. Russell Low
President & CEO
Axcelis Technologies

15:00-15:30

Technical Status, Challenges and Application Prospects of Large-sized SiC Wafers

大尺寸碳化硅单晶衬底制备技术发展现状、挑战与应用展望

Dr. Chao GAO 高超

CTO of SICC CO., LTD.

首席技术官，山东天岳先进

15:30-16:00

Advances in SiC Technology and Market

*碳化硅技术与市场进展

Dr. Qi XIANG 相奇
VP & CTO of AscenPower
副总裁兼首席技术官，广东芯粤能半导体有限公司

16:00-16:30

Failure Is Not an Option: Engineering Silicon Carbide for System Durability

*永不言败：为系统耐用性设计碳化硅

Jonathan Liao
Sr. Director of Product Marketing

Wolfspeed

16:30-16:40

Lucky Draw / 幸运抽奖，抽取大奖iPad

09:00-11:30

Session 1: Compound Semiconductors Power AI Era
分会1：化合物半导体助力人工智能时代

Day 2- Mar. 25th, 2026 Pudong Ballroom 1 / 浦东厅 1

09:15-09:45

VCSEL Applications in AI Generation
VCSEL 在人工智能时代的应用
Qingwei MO 莫庆伟
Chief Scientist of ZJ Eagles Comsemi Technology
首席科学家，浙江老鹰半导体技术有限公司

09:45-10:15

Technology and Mass Production of Diffractive AR Waveguide
AR 衍射光波导技术与量产

Kaikai DU 杜凯凯
CEO of Moldnano (Hangzhou) Technology Co., Ltd
首席执行官，慕德微纳（杭州）科技有限公司

10:15-10:40

Empowering Everything: When Advanced Power Meets Intelligent Semiconductors
赋能万物：当先进电源遇上智能半导体
Xinping YE 叶新平
Director of Product Marketing, DELTA
产品行销总监，台达

10:40-11:05

Leverage Electrical to Physical Failure Analysis Workflows to Accelerate Semiconductor Development
依靠电性-物性失效分析流程 加速半导体制程研发
Michael Rauscher
General Manager, XDB product line
Thermo Fisher Scientific

11:05-11:30

Ultra-High Thermal Conductivity Diamond: The Ultimate Thermal Revolution for AI Era

超高导热金刚石：人工智能时代的终极散热革命

Xing ZHANG 张星

CEO of Compound Semiconductor (Xiamen) Technology Co., Ltd.

首席执行官，化合积电（厦门）半导体科技有限公司

13:00-16:30

Session 2: SiC, GaN and Related WBG Materials, Equipment and Devices-1
分会2：碳化硅、氮化镓及相关宽禁带半导体材料、设备及器件（1）

Day 2- Mar. 25th, 2026 Pudong Ballroom 1 / 浦东厅 1

Moderator / 主持人：

Gan FENG, General Manager of Epiworld International Co.,Ltd

冯淦，总经理，瀚天天成电子科技（厦门）有限公司

13:00-13:30

SiC MOSFET Technology Evolution and Screening Test

碳化硅技术演变及测试筛选

Haitao HUANG 黄海涛
Deputy GM of INVENTCHIP TECHNOLOGY
副总经理，上海瞻芯电子科技股份有限公司

13:30-14:00

Breakthroughs and Emerging Applications in Thin-Film Deposition Technology
薄膜沉积技术创新突破与应用发展
Xiaotian LI 李小天
VGM of Shenzhen Naso Tech Co.,Ltd
副总经理，深圳市纳设智能装备股份有限公司

14:00-14:25

Innovative Implant Solutions Empower SiC Super Junction Cost Reduction

创新离子注入技术在SiC超结结构中的应用与成本优化

Dr. Hongchen ZHAO 赵洪辰

Worldwide Applications Director
Axcelis Technologies, Inc. 

14:25-14:50

From Silicon IGBT to SiC MOSFET: Emerging Thermal Limitations in Power Semiconductor Devices

从Si IGBT 到 SiC MOSFET：功率半导体器件中逐渐显现的热限制

Domenico Lo Verde 多梅尼科•洛•威尔德

CTO of LIONSGATE SEMI

首席技术官，上海狮门半导体有限公司

14:50-15:15

Laser Nano/Micro-Processing Technology Reshapes Semiconductor Manufacturing Process
激光微纳加工技术重塑半导体制造工艺
Wei HUANG 黄伟
事业部总经理，武汉华工激光工程有限责任公司

15:15-15:40

Next-Generation RF Generator Empowered by Ultra-High-Voltage LDMOS Power Amplifier

超高压射频 LDMOS 功率放大芯片赋能下一代半导体射频电源

Dr. Haoyu LIU 刘昊宇

产品线CEO，苏州华太电子技术有限公司 

15:40-16:05

Technology Trends and Equipment Innovation of Compound Semiconductor

化合物半导体技术发展趋势与装备创新

Xiaoliang GONG 巩小亮

Director of General Technical Department, CETC

总师办、技术总体部主任，中电科电子装备集团有限公司

16:05-16:30

Compound Semiconductors and Photonics: Markets, Applications, and Manufacturing Platforms

化合物半导体与激光技术：市场、应用与半导体制造

Qiongying HU 胡琼颖

Director of Strategic Marketing, Coherent Corp.

市场战略总监，Coherent Corp.

16:30-16:40

Lucky Draw / 幸运抽奖，抽取电动牙刷、iPad等精美奖品

09:00-11:30

Session 3: III-V Compound Semiconductors

分会3：III-V 化合物半导体

Day 3- Mar. 26th, 2026 Pudong Ballroom 1 / 浦东厅 1

Moderator / 主持人：

Shunfeng LI, Executive Director, Suzhou Everbright Institute of Semiconductor Lasers

李顺峰，董事兼常务副院长，苏州长光华芯光电技术股份有限公司

09:15-09:45

Driving The Future: High-Performance Multi-Junction VCSELs for Cars and Robotics

*驱动未来：用于汽车和机器人技术的高性能多结 VCSEL

James Liu
Founder and CEO

RaySea Technology Co., Ltd

09:45-10:15

Recent Advances in GaAs and InP-based Epitaxial Material Technologies
GaAs和InP基外延材料技术进展
Zhifa SHAN 单智发
CTO of Epihouse Optoelectronics Co., Ltd.
首席技术官，全磊光电股份有限公司

10:15-10:40

Real-Time Monitoring System: A Practical Approach to Yield Enhancement in Coater/Developer Equipment
实时监测系统在涂胶显影设备中的良率提升实践

Tao YANG 杨涛
Department Manager of New Eastech Technology Co.,Ltd.

研发经理，新毅东科技股份有限公司

10:40-11:05

Antimonide Superlattice Infrared Detection Materials and Devices Based on MBE Technology

基于 MBE 技术的锑化物超晶格红外探测材料与器件

Zhicheng XU 徐志成
CEO of Zhongke ABCSTECH
首席执行官，中科爱毕赛思

11:05-11:30

A Multi-Product Solution for SiC Substrate Defect Challenges
Jason (Yu-Hsien) Lin
Product Marketing Director
Onto Innovation

13:00-16:30

Session 4: SiC, GaN and Related WBG Materials, Equipment and Devices-2
分会4：碳化硅、氮化镓及相关宽禁带半导体材料、设备及器件（2）

Day 3- Mar. 26th, 2026 Pudong Ballroom 1 / 浦东厅 1

13:30-14:00

Driving Power Density in High Voltage GaN Converters for Advanced Energy Applications

ST 高压 GaN 功率变换器：为先进能源应用提升功率密度

Francesco MUGGERI

VP, Power Discrete & Analog Products, China, STMicroelectronics

中国区功率分立和模拟产品器件部市场和应用副总裁，意法半导体

14:00-14:25

Leading Epitaxy Solutions for High Volume Manufacturing of Compound Semiconductor & Optoelectronic Devices

领先的外延解决方案 - 助力化合物半导体与光电子器件的大规模量产

Nicolas Muesgens

Director Product Management GaN

AIXTRON SE 德国爱思强公司

14:25-14:50

Progress in Large-Size High-Quality Gallium Oxide Substrates and Epitaxial Growth

大尺寸高质量氧化镓衬底与外延进展
Jiwei JIANG 江继伟
Director of Marketing, Hangzhou Garen Semiconductor Co., Ltd

市场总监，杭州镓仁半导体有限公司

14:50-15:15

An Ion Implanter for SiC Devices
碳化硅电力电子器件用离子注入机
Weijiang ZHAO 赵维江
VGM of Nissin Ion Equipment (Shanghai) Co., Ltd.
副总经理，日亚意旺机械（上海）有限公司

15:15-15:40

Total Solution of Compound Semiconductor Epitaxy

化合物半导体外延设备及工艺解决方案

Mulong YANG 杨牧龙

GM of Compound Epitaxy Department, Beijing NAURA Microelectronics Equipment Co., Ltd.

化合物外延部门总经理，北京北方华创微电子装备有限公司

15:40-16:05

Photoluminescence : Essential Metrology Technology for GaN and SiC Epiwafers

光致发光光谱：氮化镓和碳化硅外延量测的必备技术
Hyundon Jung
Senior Corporate Officer
HORIBA STEC Korea

16:05-16:35

Compound Semiconductors Empower The AI Era Technology Evolution

*化合物半导体助力人工智能时代的技术演进

CHIU Poshun

Principal Analyst

Yole Group

16:35-16:45

Lucky Draw / 幸运抽奖，抽取电动牙刷、iPad等精美奖品